MWCS 2017 Vivo on screen Finger Print – Qualcomm Ultrasonic FP Technology

At MWC (Mobile World Congress) Shanghai 2017 Qualcomm announced a new finger print technology. This is the next gen ultrasonic finger print solution that can be placed below the screen, below the glass and even below the metal.

This new finger print technology will completely hide the finger print button giving more freedom to manufacturers when it comes to design. Since the finger print module can be placed under screen or metal there is also no need to have a dedicated button. There is also no need to create a hole on the back / front for the sensor module.

Vivo showcased the technology on their Xplay 6 handset, this was a prototype unit, just to show how the tech works. The new finger print technology by Qualcomm can be used under screen, this is laminated under the screen – the module is different and not integrated within the screen.

Vivo Finger print sensor under the screen - qualcomm ultrasonic finger print solution

This module can be used under metal and even glass. We may soon see smartphones without finger print sensor (hidden under the screen or on the back panel). Also since this tech is ultrasonic it works under water and in wet conditions.

Vivo Finger print sensor under metal qualcomm ultrasonic finger print solution

Check the video below to see it in action. Note this is a prototype unit.

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